Keywords: Electronic engineering
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Journal Articles
Circuit World (2013) 39 (2): 75–81.
Published: 10 May 2013
... and the developments of geometry design of drill bit for printed circuit boards. Hongyan Shi can be contacted at: shy‐no.1@163.com © Emerald Group Publishing Limited 2013 Electronic equipment and components Printed‐circuit boards Electronic engineering Micro drill bit Flexible printed circuit...
Journal Articles
Circuit World (2013) 39 (2): 82–94.
Published: 10 May 2013
... are generally between 0.03 and 1.00 mm. Drills of this size are easy to break when used and the microdrilling process has become one of the main technical bottlenecks in the production of PCB. Microdrilling Printed‐circuit boards Electronic engineering Thrust force Burr Optimization © Emerald...
Journal Articles
Circuit World (2012) 38 (1): 12–15.
Published: 03 February 2012
.... © Emerald Group Publishing Limited 2012 Electronic engineering Temperature Ultrasonics Ultrasound Sonication Electroless Nickel It is clear that, in contrast to the phosphorus content results, the hardness increases with bath temperature and that a higher value is always...
Journal Articles
Journal Articles
Circuit World (2011) 37 (3): 16–26.
Published: 23 August 2011
... Limited 2011 PCB design High density interconnects HDI Signal integrity SI Power integrity PI Power distribution network PDN Electrical impedance Microvia Electronic engineering is a quote from Pfeil (2011), Director of Engineering for Mentor Graphics. High‐density...
Journal Articles
Circuit World (2011) 37 (2): 8–11.
Published: 17 May 2011
..., large voids can appear when trapped gases or flux in the microvia are not able to escape during reflow. As a result, there can be joint reliability issues in service. Microvias Soldering Electronic engineering The trend in electronic devices is towards smaller and lighter...
Journal Articles
Circuit World (2009) 35 (2): 3–17.
Published: 15 May 2009
... of the following characteristics: Electronic engineering Copper Lasers Polymers Metallizing © Emerald Group Publishing Limited 2009 As the thermally induced deposition techniques produce irregular or oversized features, a more attractive approach is the use of electroless deposition...
Journal Articles
Circuit World (2008) 34 (4): 25–31.
Published: 21 November 2008
...‐gravity‐based self‐assembly for the integration of crystalline inorganic semiconductor components onto unconventional substrates such as flexible polymers. © Emerald Group Publishing Limited 2008 Electronic engineering Assembly Printed circuits Flexible electronics have drawn much...
Journal Articles
Circuit World (2008) 34 (3): 9–12.
Published: 22 August 2008
... is emitted via the transparent ITO coated substrate. Electronic engineering Microfilms Printers Luminescence Inks © Emerald Group Publishing Limited 2008 The authors acknowledge assistance in this Project from: Dr D.A. Hutt (Loughborough University) and from Gwent Electronic...
Journal Articles
Journal Articles
Circuit World (2006) 32 (1): 48.
Published: 01 January 2006
... --> Electronic engineering Books My goodness, what are “smart electronic materials”? In his introduction, Dr Singh states that humans have used smart materials for thousands of years. They are materials that respond to input with a well‐defined output. He suggests that the mud on a jungle trail is smart...
Journal Articles
Circuit World (2005) 31 (4)
Published: 01 December 2005
... chapters with diagrams and photographs Keywords: Electronic engineering, Books Jennie is one of the most well known figures in the industry and in the last ten years has been heavily involved in lead-free introduction and training workshops worldwide. This is her second lead-free textbook; her...

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