Update search
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
NARROW
Format
Journal
Type
Issue Section
Date
Availability
1-12 of 12
Keywords: Electronic engineering
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Journal:
Circuit World
Circuit World (2013) 39 (2): 75–81.
Published: 10 May 2013
... and the developments of geometry design of drill bit for printed circuit boards. Hongyan Shi can be contacted at: shy‐no.1@163.com © Emerald Group Publishing Limited 2013 Electronic equipment and components Printed‐circuit boards Electronic engineering Micro drill bit Flexible printed circuit...
Journal Articles
Journal:
Circuit World
Circuit World (2013) 39 (2): 82–94.
Published: 10 May 2013
... are generally between 0.03 and 1.00 mm. Drills of this size are easy to break when used and the microdrilling process has become one of the main technical bottlenecks in the production of PCB. Microdrilling Printed‐circuit boards Electronic engineering Thrust force Burr Optimization © Emerald...
Journal Articles
Journal:
Circuit World
Circuit World (2012) 38 (1): 12–15.
Published: 03 February 2012
.... © Emerald Group Publishing Limited 2012 Electronic engineering Temperature Ultrasonics Ultrasound Sonication Electroless Nickel It is clear that, in contrast to the phosphorus content results, the hardness increases with bath temperature and that a higher value is always...
Journal Articles
Journal:
Circuit World
Circuit World (2011) 37 (3): 27–34.
Published: 23 August 2011
... Publishing Limited 2011 Boundary scan BIST TPG Off‐chip interconnects Faults Electrical testing Electronic engineering The on‐board interconnects are metal structures used to connect different devices/components on it. In the age of modern electronics, the use of multilayered high...
Journal Articles
Journal:
Circuit World
Circuit World (2011) 37 (3): 16–26.
Published: 23 August 2011
... Limited 2011 PCB design High density interconnects HDI Signal integrity SI Power integrity PI Power distribution network PDN Electrical impedance Microvia Electronic engineering is a quote from Pfeil (2011), Director of Engineering for Mentor Graphics. High‐density...
Journal Articles
Journal:
Circuit World
Circuit World (2011) 37 (2): 8–11.
Published: 17 May 2011
..., large voids can appear when trapped gases or flux in the microvia are not able to escape during reflow. As a result, there can be joint reliability issues in service. Microvias Soldering Electronic engineering The trend in electronic devices is towards smaller and lighter...
Journal Articles
J.H.‐G. Ng, M.P.Y. Desmulliez, M. Lamponi, B.G. Moffat, A. McCarthy, H. Suyal, A.C. Walker, K.A. Prior, D.P. Hand
Journal:
Circuit World
Circuit World (2009) 35 (2): 3–17.
Published: 15 May 2009
... of the following characteristics: Electronic engineering Copper Lasers Polymers Metallizing © Emerald Group Publishing Limited 2009 As the thermally induced deposition techniques produce irregular or oversized features, a more attractive approach is the use of electroless deposition...
Journal Articles
Journal:
Circuit World
Circuit World (2008) 34 (4): 25–31.
Published: 21 November 2008
...‐gravity‐based self‐assembly for the integration of crystalline inorganic semiconductor components onto unconventional substrates such as flexible polymers. © Emerald Group Publishing Limited 2008 Electronic engineering Assembly Printed circuits Flexible electronics have drawn much...
Journal Articles
Journal:
Circuit World
Circuit World (2008) 34 (3): 9–12.
Published: 22 August 2008
... is emitted via the transparent ITO coated substrate. Electronic engineering Microfilms Printers Luminescence Inks © Emerald Group Publishing Limited 2008 The authors acknowledge assistance in this Project from: Dr D.A. Hutt (Loughborough University) and from Gwent Electronic...
Journal Articles
Journal:
Circuit World
Circuit World (2008) 34 (1): 3–12.
Published: 08 February 2008
.... electrical performance and reliability at the component level. © Emerald Group Publishing Limited 2008 Adhesives Electronic engineering Printed circuits Semiconductor devices In conclusion, a variety of nano‐and micro‐filled copper, silver and LMP‐based conducting adhesives were...
Journal Articles
Journal:
Circuit World
Circuit World (2006) 32 (1): 48.
Published: 01 January 2006
... --> Electronic engineering Books My goodness, what are “smart electronic materials”? In his introduction, Dr Singh states that humans have used smart materials for thousands of years. They are materials that respond to input with a well‐defined output. He suggests that the mud on a jungle trail is smart...
Journal Articles
Journal:
Circuit World
Circuit World (2005) 31 (4)
Published: 01 December 2005
... chapters with diagrams and photographs Keywords: Electronic engineering, Books Jennie is one of the most well known figures in the industry and in the last ten years has been heavily involved in lead-free introduction and training workshops worldwide. This is her second lead-free textbook; her...
