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1-11 of 11
Keywords: Electronic equipment and components
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Journal Articles
Journal:
Circuit World
Circuit World (2013) 39 (2): 75–81.
Published: 10 May 2013
... and the developments of geometry design of drill bit for printed circuit boards. Hongyan Shi can be contacted at: shy‐no.1@163.com © Emerald Group Publishing Limited 2013 Electronic equipment and components Printed‐circuit boards Electronic engineering Micro drill bit Flexible printed circuit...
Journal Articles
Journal:
Circuit World
Circuit World (2013) 39 (1): 4–8.
Published: 01 February 2013
... rigid‐flex technology is due to the fact that such circuits tend to be much more complex in terms of both their engineering and processing. © Emerald Group Publishing Limited 2013 Electronic equipment and components Assembly Soldering Aluminum rigid flex Thermal management Embedded...
Journal Articles
Journal:
Circuit World
Circuit World (2011) 37 (4): 10–15.
Published: 22 November 2011
...). Whiskers Tin whiskers Electroplated tin Electronic equipment and components Organic additives Plating Surface modification Lead‐free Sn/Pb Copper As the implementation of the ROHS Directive continues to affect the electronics industry, tin and tin alloys remain the first choice...
Journal Articles
Journal:
Circuit World
Circuit World (2010) 36 (2): 33–39.
Published: 18 May 2010
... and processes including a time stamp, any recorded test results and also documentation of which operators performed activities during the life cycle of the product. Printed circuits Electronic equipment and components Tracer methods Design for assembly Manufacturing systems The globalised...
Journal Articles
Journal:
Circuit World
Circuit World (2009) 35 (1): 16–21.
Published: 06 February 2009
... Zhang can be contacted at: xiaz@chalmers.se © Emerald Group Publishing Limited 2009 Substrates Liquid crystal polymers Plasma physics Electronic equipment and components In this paper, the photolithography was carried out by using a KS MJB3 400 nm mask aligner. After trying...
Journal Articles
Journal:
Circuit World
Circuit World (2008) 34 (3): 31–39.
Published: 22 August 2008
... and interconnection systems like printed circuit boards, has been published in a previous issue of Circuit World (Smith, 2007a). The aim of this paper is to discuss further those methods of failure analysis which employ X‐rays and X‐ray instrumentation. Radiography Spectroscopy Electronic equipment...
Journal Articles
Journal:
Circuit World
Circuit World (2008) 34 (1): 35–41.
Published: 08 February 2008
... Television Television equipment Electronic equipment and components Other displays that incorporate a dye are dye phase change displays. These are LCDs where the rotation of the planes in a guest‐host liquid crystal layer can be as high as two or three turns (1 turn = 360o). The nematic liquid...
Journal Articles
Journal:
Circuit World
Circuit World (2007) 33 (2): 52–58.
Published: 22 May 2007
... strategies and methodologies for reprocessing WEEE into primary and secondary products, and where possible the recovery of higher added‐value components and materials. © Emerald Group Publishing Limited 2007 Recycling Waste recovery Electrical equipment Electronic equipment and components...
Journal Articles
Journal:
Circuit World
Circuit World (2007) 33 (1): 31–35.
Published: 13 February 2007
... follows closely that of standard lithographic inks and includes: polymeric ink vehicle mixed; conductive particulate introduced; three roll milling; fineness of grind dispersion tested; and assessment of rheological properties. Inks Electronic equipment and components Printed...
Journal Articles
Journal:
Circuit World
Circuit World (2007) 33 (1): 5–8.
Published: 13 February 2007
... an electrical short. A large quantity of zinc whiskers, which were grown on zinc‐plated coupons, were harvested for the test. Tin whiskers are much more difficult to grow and harvest. Electronic equipment and components Electric breakdown Electric current Risk assessment Owing to the new...
Journal Articles
Journal:
Circuit World
Circuit World (2007) 33 (1): 15–21.
Published: 13 February 2007
... or interconnection system is conducted, and what can be learnt from the investigation. © Emerald Group Publishing Limited 2007 Electronic equipment and components Radiography Reliability management Another common problem in ultrasonic wedge bonding are cracks which sometimes appear in the heal...
