...Martin Goosey Over the last few years, the emergence of new European draft legislation has focussed electronics industry attention on the likely ultimate proscription of lead in electronics assembly. Much work has already been undertaken to identify the possible alternatives to conventional tin...

... vessel were subsequently replaced to accommodate higher ozone concentrations, higher UV output and increased reactor volume. © MCB UP Limited 2003 Electroplating Electronics assembly Innovation The experimental programme investigated the influence of various parameters...

... Limited 2002 Electronics assembly Surface mount technology The first part of this article was published in Circuit World (Volume 28, Issue 2) and in this second part the final stages of large format backplane manufacture from the desmear and metallisation process onwards are described...

... the cross section to be manufactured without any significant impact on the yield. Printed circuit boards Electronics assembly The trend in the electronics industry towards the miniaturisation of electronic assemblies has resulted in the development of PCBs possessing small vias that connect...

... reviews the current understanding of the black pad failures and details work carried out by Shipley to extend this knowledge and to help users minimise the likelihood of its formation. © MCB UP Limited 2002 Surface films Electronics assembly The widespread adoption of surface mount...

... alignment on the exposure unit and the use of post‐etch punching to plotted fiducials will optimise alignment of images throughout the stack. Printed circuit boards Electronics assembly © MCB UP Limited 2002 The manufacture of printed wiring boards (PWBs) is rapidly diversifying...