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Keywords: Electronics packaging
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Journal Articles
Electronics Packaging Technology Update: BGA, CSP, DCA and Flip Chip
Available to Purchase
Journal:
Circuit World
Circuit World (1997) 23 (4): 22–25.
Published: 01 December 1997
... is the solution. © MCB UP Limited 1997 Electronics packaging Microelectronics Integrated circuit The invention of the bipolar transistors by Bardeen,Brattain and Shockely at Bell Laboratories in 1974 foreshadowed the development of generations of computers yet to come. The invention...
Journal Articles
Design of a Low‐cost Wire Bond Tape Ball Grid Array Package
Available to Purchase
Journal:
Circuit World
Circuit World (1996) 22 (3): 10–15.
Published: 01 December 1996
... and the board beneath, thus reducing any warpage and ensuring more uniform stress on the solder joints. The thin adhesive layer also offers an advantage from an electrical standpoint. Ball grid array Tape ball grid array Electronics packaging The gain in popularity of ball grid array(BGA...
Journal Articles
Development of Flip‐chip Joining Technology on Flexible Circuitry Using Anistropically Conductive Adhesives and Eutectic Solder*
Available to Purchase
Journal:
Circuit World
Circuit World (1996) 22 (2): 19–24.
Published: 01 August 1996
...J. Liu; K. Boustedt; Z. Lai Electronic packaging is increasingly becoming a vital part of the electronics industry, representing a key barrier to cost reduction and performance improvement. Of all the packaging methods,flip‐chip technology offers, up to now, the highest packaging density and best...
