...Zhihua Tao; Guanting Liu; Yuanxun Li; Hua Su Purpose The adsorption and acceleration behavior of 3-mercaptopropyl sulfonate (MPS) were investigated by electrochemical tests for microvia filling by copper electroplating. Design/methodology/approach The synergistic effects of one suppressor...

...Thomas D.A. Jones; David Flynn; Marc P.Y. Desmulliez; Dennis Price; Matthew Beadel; Nadia Strusevich; Mayur Patel; Chris Bailey; Suzanne Costello Purpose This study aims to understand the influence of megasonic (MS)-assisted agitation on printed circuit boards (PCBs) electroplated using copper (Cu...

...‐in‐a‐package PCB manufacturing Laminations Electroplating Heterogeneous integration Micro‐devices Packaging Electromechanical devices Micro‐electromechanical systems (MEMS) are small devices with tiny moving parts designed to perform sensing or actuation functions. Successful commercial products...

... for optimal PCB production. © Emerald Group Publishing Limited 2010 Vertical conveyorized mechanization has become increasingly popular, especially for thin materials and HDI. Figure 2 shows four typical applications. Vertical electroplating of panels for panel‐plate or pattern‐plate...

...; and as a “conductive” layer which is coherent and conductive enough to allow “direct” electroplating of the through hole. The employment of nanoparticles means that an effective method of dispersion is required and this paper studies the use of mechanical agitation and ultrasound for this purpose. Design...

... than in non‐metallic systems (Ebnesaijad and Ebnesaijad, 2006). © Emerald Group Publishing Limited 2009 Electroplating Copper Adhesion Printed circuits Plastics Surface treatment This paper examines the electroless plating of a novel injection moulded flame‐retardant...

...Stuart Lambert Purpose To study the influence of temperature on the electroplating efficiency of various metals from ionic liquids. Design/methodology/approach Copper, silver, nickel and tin, in the form of metal chlorides, were dissolved in a number of ionic liquids. After using cyclic...

...A.J. Cobley; D.R. Gabe Despite the fact that insoluble anodes are becoming more utilized in acid copper electroplating for printed circuit board manufacture, little work has been published on the impact of using such anodes on the process control of the baths or their effect on the electroplated...

... vessel were subsequently replaced to accommodate higher ozone concentrations, higher UV output and increased reactor volume. © MCB UP Limited 2003 Electroplating Electronics assembly Innovation The experimental programme investigated the influence of various parameters...

...Mark Lefebvre; George Allardyce; Masaru Seita; Hideki Tsuchida; Masaru Kusaka; Shinjiro Hayashi This paper describes a copper electroplating enabling technology for filling microvias. Driven by the need for faster, smaller and higher performance communication and electronic devices, sequential...

... and capability. This is especially true with the complications of electroplating chemistry and pulse reverse waveforms. TECNU has now introduced a new K-Factor Amp-Time Counter which allows the process team to model the fact that material is deposited and removed at different rates during the electrochemical...

..., it is also necessary to have a high‐speed acid copper electroplating process that, by implication, must be capable of operating at very high current densities. This paper outlines the fundamental electrochemical principles of acid copper electroplating and explains how these impact on high speed...

... electroplated with tin‐lead (Sn‐Pb). With the advent of Pb‐free electronics finishing, the risk of tin whiskers is again a significant concern. This paper will review the theories behind whisker formation, identify the common characteristics of same, and demonstrate how Pb‐free electroplating processes can...

... © MCB UP Limited 2000 --> PAL IML Shipley Ronal Electroplating Printed circuit boards Keywords PAL, IML, Shipley Ronal, Electroplating, Printed circuit boards IS014000 regulations and increased circuit complexity have forced PCB manufacturers to seek ever more...

..., since gold to gold and aluminum to aluminum wire bonds showed the highest interface reliability in high volume production (Harman, 1997a). In this work, a Dage pull tester, Model BT22PC, was used for the destructive test. © MCB UP Limited 1999 Electroplating Leadframes Printed circuit...

... breakdown products are fully analyzable with conventional analytical methods. Extensive bath life studies show that the deposit appearance and material properties, including grain structures, are stable in relation to the age of the electroplating chemistry. In addition, the grain refiners used are highly...