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Keywords: Encapsulants
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Journal Articles
Encapsulant materials systems for flip‐chip‐on‐board assemblies: addressing manufacturing issues
Available to Purchase
Journal:
Circuit World
Circuit World (1998) 24 (1): 7–12.
Published: 01 January 1998
...Daniel R. Gamota; Cindy M. Melton Encapsulant materials for flip‐chip‐on‐board (FCOB) were developed to address issues that have been observed during assembly of consumer electronic products on a high volume manufacturing FCOB/SMT line. The viscosity, surface tension, and filler particle sizes...
Journal Articles
Effect of Delamination on Moisture Accelerated Failures in Plastic Encapsulated Microcircuits
Available to Purchase
Journal:
Circuit World
Circuit World (1997) 23 (4): 11–15.
Published: 01 December 1997
...M. Pecht; Y. Ranade; J. Pecht This paper presents a study to determine the extent to which delamination at the die to encapsulant interface affects the package moisture content, and electrical failures when subjected to unbiased temperature‐humidity testing. Moisture absorption experiments showed...
