... structure, traditional PN cured epoxy resin results in having excellent thermal resistance, low water absorption and anti‐CAF capability. Originality/value Provides a comparison of interest to all those involved with laminate and prepreg materials in the circuit board industry. Figure 7 shows...

... in the final PCB drillability. Three resin systems were chosen for this study namely Standard FR4 epoxy resin cured with DICY, D.E.R.™ 592 [1] cured with DICY and System 1 cured with a multifunctional phenolic curing agent (Table I). This sample set provided the breadth in performance that was needed...

...‐TM650‐2.6.16. The flexural strength of the laminates was measured according to IPC‐TM650‐2.4.4B. The copper peel strength tests were performed according to IPC‐TM650‐2.4.8C. Laminate samples were used “as received”. Epoxy resins Adhesion Thermal stability FR‐4 laminates are widely...

... © Emerald Group Publishing Limited 2004 --> Epoxy resins Park Electrochemical introduces N4000-12 enhanced epoxy materials system Keywords: Epoxy resins Park Electrochemical Corporation has introduced their new N4000-12 enhanced epoxy dielectric substrate...

... have focused on improving the T_g and thermal resistance to broaden the operating window of conventional FR‐4. Printed‐circuit boards Epoxy resins Thermal properties of materials The recent developments in electronics products and circuit assembly technology have forced...