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Keywords: Flip‐chip
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Journal Articles
Journal:
Circuit World
Circuit World (2012) 38 (4): 214–218.
Published: 16 November 2012
...Mark W. Sugden; David A. Hutt; David C. Whalley; Changqing Liu Purpose The purpose of this paper is to present an outline of the development of a new process for the formation of flip‐chip interconnections using metal coated polymer microparticles. Design/methodology/approach Metal coated...
