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1-4 of 4
Keywords: Heat dissipation
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Journal Articles
Michal Baszynski, Edward Ramotowski, Dariusz Ostaszewski, Tomasz Klej, Mariusz Wojcik, Mikko Kohvakka, Anssi Kamari
Journal:
Circuit World
Circuit World (2016) 42 (1): 32–36.
Published: 01 February 2016
... – Four PCBs with the same layout but made with use of different materials and technologies have been investigated using thermal camera to compare their thermal properties. Findings – The results show how important the thermal properties of PCBs are for providing effective heat dissipation, and how...
Journal Articles
Journal:
Circuit World
Circuit World (2016) 42 (1): 17–22.
Published: 01 February 2016
... project. Mariusz Wojcik can be contacted at: mariusz.wojcik@pl.abb.com © Emerald Group Publishing Limited 2016 Embedded passive FR-4 Heat dissipation Embedded resistor Embedded Prepreg Figure 3 ECT board top view Figure 4 Inner layer of ECT board...
Journal Articles
Journal:
Circuit World
Circuit World (2015) 41 (2): 55–60.
Published: 05 May 2015
...Yuanming Chen; Shouxu Wang; Xuemei He; Wei He; Vadim V. Silberschmidt; Ze Tan Purpose – The purpose of this paper is to form copper coin-embedded printed circuit board (PCB) for high heat dissipation. Design/methodology/approach – Manufacturing optimization of copper coin-embedded PCB...
Journal Articles
Journal:
Circuit World
Circuit World (2014) 40 (1): 17–22.
Published: 28 January 2014
... and thermal constants. Findings – The effectiveness of heat dissipation from resistor is determined by the type of substrate material, width of conductive paths, and contact material. The best results were observed for elements with wider conductive paths made of Cu or Ni/Au. The LTCC substrate ensures...
