Keywords: Integrated circuits
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Journal Articles
Journal Articles
Circuit World (2012) 38 (4): 214–218.
Published: 16 November 2012
... polymer microparticles were selectively deposited onto the bondpads of integrated circuits using electrophoresis. Thermocompression bonding was then used to bond the devices to substrates. Findings Particles obtained a positive surface charge following immersion in an acidic solution and this surface...
Journal Articles
Circuit World (2008) 34 (3): 3–8.
Published: 22 August 2008
...; and shortening of the interconnect length between components using a 3D architecture of the wiring. © Emerald Group Publishing Limited 2008 Assembly Integrated circuits Silicon Laminates In electronic circuit technology there is a clear trend towards mechanically flexible circuits...
Journal Articles
Circuit World (2007) 33 (4): 20–25.
Published: 27 November 2007
... that deflect optical signals by 90° into and out of the waveguides. Here, an alternative approach is proposed that launches light directly into the waveguide ends. © Emerald Group Publishing Limited 2007 Polymers Integrated circuits Circuit boards The increasing physical constraints...
Journal Articles
Circuit World (2005) 31 (4)
Published: 01 December 2005
...Bob Willis © Emerald Group Publishing Limited 2005 --> Integrated circuits Integrated circuit technology Books Weifeng Liu and Michael PechtWiley Interscience216 pages, 12 chapters with illustrations and photographs Keywords: Integrated circuits, Integrated circuit...
Journal Articles
Circuit World (2004) 30 (4)
Published: 01 December 2004
...Brian Ellis © Emerald Group Publishing Limited 2004 --> CMOS Integrated circuits Design Books Thomas H. LeeCambridge University Press, EnglandISBN 0 521 83539 9797 + xviii pp., 20 ch. Hardback (185 × 260 × 42 mm)Price GBP 45.00 USD 75.00 Keywords: CMOS, Integrated...
Journal Articles
Circuit World (2001) 27 (4): 22–25.
Published: 01 December 2001
... free up valuable surface area. Integrated circuits Printed circuit boards Components © MCB UP Limited 2001 During the project, ISOLA made significant progress in the development and fabrication of very thin “FR‐4 type” laminates with higher dielectric constants which enable...

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