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Keywords: Interconnections
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Journal Articles
Pre-curing investigation of filling conductive paste in prepreg to interconnect two multilayer structures of backboard for press-fit application
Available to Purchase
Journal:
Circuit World
Circuit World (2016) 42 (3): 104–109.
Published: 01 August 2016
...Shouxu Wang; Ting Yang; Yuanming Chen; Wei He; Yongsuan Hu; Xinhong Su Purpose The purpose of this paper is to form high density interconnection (HDI) of backboard for press-fit applications with the pre-curing conditions of conductive paste. The best condition of pre-curing conductive paste...
Journal Articles
A novel flip‐chip interconnection process for integrated circuits
Available to Purchase
Journal:
Circuit World
Circuit World (2012) 38 (4): 214–218.
Published: 16 November 2012
...Mark W. Sugden; David A. Hutt; David C. Whalley; Changqing Liu Purpose The purpose of this paper is to present an outline of the development of a new process for the formation of flip‐chip interconnections using metal coated polymer microparticles. Design/methodology/approach Metal coated...
