...William Burr; Nick Pearne; Francesca Stern Purpose The purpose of this paper is to a provide short introductory overview of metal in board (MiB) circuit technologies for use in thermal management applications. Design/methodology/approach The paper details the types of metal in printed circuit...

...Brent Roeger Purpose The purpose of this paper is to demonstrate laser microvia drilling of polyimide thin films from multiple sources before metallic sputtering. This process flow reduces Flexible Printed Circuit Board (FPCB) material, chemical and operational costs by 90 per cent...

...Fumin Song; Lianyu Fu; Fei Zhang Purpose The purpose of this paper is to present and describe a solution of aluminum substrate drilling. Design/methodology/approach The development of LED and printed circuit board with metal substrate are reviewed first. Then the challenges of drilling metal...

... the electrons that will in turn reduce the palladium ion in solution to palladium metal on the surface. To ensure a complete uniform palladium catalyst deposit, the bath must be run according to the supplier's specification of chemical composition, temperature, dwell time, and bath life. The micro‐etch bath...

... sample X2 and X3. Printed circuits Solders Soldering Metals One of the most significant failures of soldering technology nowadays concerns wetting failures between the solder material and the final finishes of the printed circuit boards (PCB). Owing to various reasons, a uniform...

... and van Lieshout, 1936). For example, in dilute Sn‐Ge alloys (0.1‐0.5 mass per cent) the transition temperature is reduced by 50 K per kbar. © Emerald Group Publishing Limited 2007 Metals Solders Soldering involves the formation of an intermetallic compound (IMC) between the metallic...

...Wouter Ghyoot; Rebecca Green; Bryan Fisher Purpose Metallic nickel and four nickel compounds are undergoing a risk assessment in the European Union. The outcomes of this risk assessment may be used for a revision of existing or introduction of new occupational exposure limits (OELs...

... of the risks of shortcuts involved. The main driving force for whiskers is an accumulation of internal stress created by diffusion at the boundary of copper and tin. A nano layer deposited from an organic metal‐based pre‐dip significantly reduces the diffusion by creating a unique sandwich layer with smooth...

... with PBGA packages, and tested in four‐point bending. When joint strength is strong, bending tests resulted in peeling off the PCB pads; otherwise, brittle fractures occurred at the interface between solder balls and PCB pads. After aging, solder joints on all Ni/Pd/Au and reference metal finishes failed...