...Mark Bachman; G.P. Li Purpose The purpose of this paper is to present the utilities of packaging and PCB fabrication processes for manufacturing micro electromechanical systems (MEMS) and its package for sensing and actuation applications. Design/methodology/approach A broad array...

...Keryn Lian; Manes Eliacin; Robert Lempkowski; Marc Chason; Matthew O'Keefe; James Drewniak Purpose The purpose of this paper is to present a new class of printed circuit board (PCB)‐based, radio frequency micro‐electro‐mechanical systems (RF‐MEMS) switches and to describe the packaging method...

...Lianyu Fu; Qiang Guo Purpose The paper aims to present key points regarding the development of an ultra‐small micro drill bit for packaging substrate hole processing. Design/methodology/approach Key points for the development of ultra‐small drill bits are presented. These are based on a study...

... have been developed accordingly. However, future microelectronic packaging schemes and microsystems may require patterning to be achieved on grossly non‐planar surfaces. We have demonstrated that this can be achieved on ink‐jet print heads using photolithography and point to the research necessary...

...David Kingsley Professor   Johan   Liu (Ed.) . Conductive Adhesives for Electronic Packaging . Electrochemical Publications , 1999 . , ISBN: ISBN: 0901150371 Publication Packaging Adhesives It is true to say that, until the 1990s, electronic manufacturing...

...John H. Lau; Chris Chang; Tony Chen; David Cheng; Eric Lao A new solder‐bumped flip chip land grid array (LGA) chip scale package (CSP) called NuCSP is presented in this paper. NuCSP is a minimized body size package with a rigid substrate (interposer). The design concept is to utilize...

...T. Chou; J. Lau Presents a new wire bondable land grid array (LGA) chip scale package called NuCSP. NuCSP is a minimized body size wire bondable package with rigid substrate interposer. The design concept is to utilize the plating bars on the edges of the package substrate as the wire bond fingers...