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Keywords: Power electronics modules
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Journal Articles
Application of direct bonded copper substrates for prototyping of power electronic modules
Available to PurchaseWojciech Grzesiak, Piotr Maćków, Tomasz Maj, Beata Synkiewicz, Krzysztof Witek, Ryszard Kisiel, Marcin Myśliwiec, Janusz Borecki, Tomasz Serzysko, Marek Żupnik
Journal:
Circuit World
Circuit World (2016) 42 (1): 23–31.
Published: 01 February 2016
... at: synkiewicz@ite.waw.pl SMT DBC substrates Power electronics modules The origins of direct bonded copper (DBC) substrate technology date back to the mid-1980s, when it was developed and patented by the General Electric Company. Combining the high thermal conductivity of copper, and its high...
