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Keywords: SMT
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Journal Articles
Techniques of impedance matching for minimal PCB channel loss at 40 GBPS signal transmission
Available to Purchase
Journal:
Circuit World
Circuit World (2019) 45 (3): 132–140.
Published: 21 June 2019
...Chang Fei Yee; Muammar Mohamad Isa; Azremi Abdullah Al-Hadi; Mohd Khairuddin Md Arshad Purpose This paper aims to analyze the negative impact of surface mount (SMT) pad and imperfect via structure such as stub, pad, non-functional pad (NFP) and anti-pad on the signal integrity at 40 Gbps...
Journal Articles
Application of direct bonded copper substrates for prototyping of power electronic modules
Available to PurchaseWojciech Grzesiak, Piotr Maćków, Tomasz Maj, Beata Synkiewicz, Krzysztof Witek, Ryszard Kisiel, Marcin Myśliwiec, Janusz Borecki, Tomasz Serzysko, Marek Żupnik
Journal:
Circuit World
Circuit World (2016) 42 (1): 23–31.
Published: 01 February 2016
... at: synkiewicz@ite.waw.pl SMT DBC substrates Power electronics modules The origins of direct bonded copper (DBC) substrate technology date back to the mid-1980s, when it was developed and patented by the General Electric Company. Combining the high thermal conductivity of copper, and its high...
