... mentioned earlier. Accepting these arguments one can begin to look back at the electronic patent history and find plenty of evidence of through silicon vias (TSVs), IC chip stacking and IC package stacking from nearly 50 years ago. While the search performed in preparation for this paper was neither...

... with suitable tooling for placing small and thin dice on flexible substrates. Findings The cost analysis of inkjet printing suggests that it may not be substantially less expensive than conventional silicon technology for this purpose, while achieving inferior performance. Offset printing is cheaper...

... μm thick chip is bendable. Research limitations/implications Further development work includes reliability testing, embedding of the UTCP in conventional flex, and construction of functional demonstrators using the developed technologies. Originality/value Thinning down silicon chips...

...Denis Sweatman; Olly Powell; Shinoj Francis Purpose To detail results of research into optical waveguides fabricated from silicon on insulator (SOI) for on‐chip high speed applications and from polymer for more general applications. Design/methodology/approach This paper shows the processes...