... point of it, it was simply a fact. (That said, the technique was applied to chips in some development projects in the 1980s and 1990s by TI and others). Electronics industry Microprocessor chips Computer components Silicon 3D interconnections Stacked chip packages Through silicon via (TSV...

... with suitable tooling for placing small and thin dice on flexible substrates. Findings The cost analysis of inkjet printing suggests that it may not be substantially less expensive than conventional silicon technology for this purpose, while achieving inferior performance. Offset printing is cheaper...

... μm thick chip is bendable. Research limitations/implications Further development work includes reliability testing, embedding of the UTCP in conventional flex, and construction of functional demonstrators using the developed technologies. Originality/value Thinning down silicon chips...

...Denis Sweatman; Olly Powell; Shinoj Francis Purpose To detail results of research into optical waveguides fabricated from silicon on insulator (SOI) for on‐chip high speed applications and from polymer for more general applications. Design/methodology/approach This paper shows the processes...