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Keywords: Solder paste
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Journal Articles
Christopher Bailey, Hua Lu, Greg Glinski, Daniel Wheeler, Phil Hamilton, Mike Hendriksen, Brian Smith
Journal:
Circuit World
Circuit World (2002) 28 (1): 14–20.
Published: 01 March 2002
... the application of computational modelling techniques that have the ability to predict a range of interacting physical phenomena associated with the manufacturing process. For example, in the flip‐chip assembly process we have solder paste deposition, solder joint shape formation, heat transfer, solidification...
