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Keywords: Solderable finish
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Journal Articles
Journal:
Circuit World
Circuit World (2012) 38 (2): 64–67.
Published: 11 May 2012
...‐circuit boards Signal processing Digital technology Copper Nickel Gold Solderable finish Insertion loss PCB signal integrity Skin depth Attenuation Selective plating Digital applications Ultra high frequency effects Ni‐Au The recent development of ultra high speed differential...
Journal Articles
Andy Ballantyne, Greg Forrest, Martin Goosey, Asta Griguceviciene, Jurga Juodkazyte, Rod Kellner, Aleksandr Kosenko, Rimantas Ramanauskas, Karl Ryder, Algirdas Selskis, Rima Tarozaite, Erik Veninga
Journal:
Circuit World
Circuit World (2012) 38 (1): 21–29.
Published: 03 February 2012
... ASPIS project that is undertaking a multi‐faceted approach to develop novel and improved nickel‐gold (ENIG) solderable finish chemistries and processes in order to overcome issues such as “black pad” that are known to cause reliability issues. Design/methodology/approach The ASPIS project has four...
