... solder. To design a model that describes the degradation of wetting behaviour after reflow‐cycling of the immersion tin final finish. Design/methodology/approach A special printed circuit boards (PCB) demonstrator was created to investigate the immersion tin final finish with surface analysis methods...

...W.J. Plumbridge Purpose To review the literatures, and to consider the latest results regarding the formation of tin pest in lead‐free solders and interconnections. Design/methodology/approach Previous work, over almost a century, on tin pest formation in tin and its alloy has been critically...

...C.M. Chan; K.H. Tong; R.W.M. Kwok Purpose To investigate the relationship between intermetallic compound (IMC) formation and solderability for immersion tin deposit under different number of reflows. Design/methodology/approach Scanning Auger microscopy and X‐ray photoelectron spectrometer...

...‐circuit boards Ink jet printers Solders The manufacture of printed circuit boards (PCBs) takes many steps and a significant number of those steps involve subtractive processes (photolithography) whereby copper is etched away to leave the required circuit structure. This process has served...

...Pete Starkey © MCB UP Limited 2002 --> Reviewing the position of ink–jet printing in the printed circuit industry, Ian observed that it was a disruptive technology which was causing fabricators to reconsider their traditional perception of imaging processes for solder mask...

...C. Hillman; K. Rogers; A. Dasgupta; M. Pecht; R. Dusek; B. Lorence This paper presents the defects that occur during the assembly and manufacturing of solder joints in single‐sided insertion‐mount printed wiring boards (PWBs). Each type of defect is discussed, with particular focus on how...

...John H. Lau; Chris Chang; Tony Chen; David Cheng; Eric Lao A new solder‐bumped flip chip land grid array (LGA) chip scale package (CSP) called NuCSP is presented in this paper. NuCSP is a minimized body size package with a rigid substrate (interposer). The design concept is to utilize...

...B.D. Dunn The various electronic component parts and materials that are used in the construction of spacecraft electronic boxes have been chemically analysed. An elemental distribution is recorded for items that include paint, aluminium alloy structure, printed circuit boards and their soldered...

... on the basis of a combination of heating to above the solder melting temperature and applying impacting the shearing forces. Most of the electronic components were recovered undamaged and the solder was able to be recovered as particles. The solder remaining on the board was recovered by abrading the board...