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Keywords: Thermal simulation
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Journal Articles
Journal:
Circuit World
Circuit World (2015) 41 (2): 55–60.
Published: 05 May 2015
... involved in the design and treatment of copper coin, resin flush removal and flatness control. Thermal simulation was used to investigate the effect of copper coin on heat dissipation of PCB products. Lead-free reflow soldering and thrust tests were used to characterize the reliable performance of copper...
Journal Articles
Journal:
Circuit World
Circuit World (2015) 41 (1): 14–19.
Published: 02 February 2015
... materials and thickness of copper plated on vias on thermal conductivity. © Emerald Group Publishing Limited 2015 Thermal conductivity Copper plating thickness Heat dissipation vias Thermal simulation Nowadays, large quantities of printed circuit boards (PCBs) are being used...
