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Keywords: Thermal stability
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Journal Articles
Journal:
Circuit World
Circuit World (2004) 30 (4): 20–26.
Published: 01 December 2004
...‐TM650‐2.6.16. The flexural strength of the laminates was measured according to IPC‐TM650‐2.4.4B. The copper peel strength tests were performed according to IPC‐TM650‐2.4.8C. Laminate samples were used “as received”. Epoxy resins Adhesion Thermal stability FR‐4 laminates are widely...
