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Keywords: Trade fairs
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Journal Articles
Journal:
Circuit World
Circuit World (2005) 31 (2)
Published: 01 June 2005
... hexagonal structures they can exchange atoms relatively easily. In the tin-copper alloy the nickel helps to reduce copper dissolution into the solder and it also helps to give the solder a smoother surface. © Emerald Group Publishing Limited 2005 --> Electronics industry Trade fairs Printed...
