... and thermal stress. Illustrates the application of modelling technology being used as part of a larger UK study aiming to establish a process route for high‐volume, low‐cost, sub‐100‐micron pitch flip‐chip assembly. © Company 2002 Flip chip Solder paste Reflow Underfill Reliability Modelling...

... obtained after an almost‐one‐year temperature cycling test. The process steps of underfilling and curing of underfill can be omitted when a suitable epoxy is used for encapsulation. When underfill is conducted, encapsulation is not necessarily needed from a reliability point of view. 1. 1 placing...