..., the functional properties of the surface finishes including their wire bonding performance have also been investigated at Bell Laboratories. In this study, gold and aluminum wire bonding to palladium finishes was tested and the wire bond pull force and break position were examined in order to optimize...

...T. Chou; J. Lau Presents a new wire bondable land grid array (LGA) chip scale package called NuCSP. NuCSP is a minimized body size wire bondable package with rigid substrate interposer. The design concept is to utilize the plating bars on the edges of the package substrate as the wire bond fingers...