Dual-arm robot offers 2x increase in wafer throughput

Dual-arm robot offers 2x increase in wafer throughput

Equipe Technologies Inc.,the leading supplier of robotic wafer-handling systems, announced the breakthrough design of a new dual-arm atmospheric robot capable of handling both 200mm and 300mm wafers. With a 2-3 second wafer swap time the DBM 2400 Series offers twice the throughput of conventional dual-arm designs with a significantly smaller footprint. The DBM 2400 Series robot is designed specifically for singlewafer applications. It is based on a direct-drive motor technology, which has very few moving parts. Its industry-leading performance is achieved by high-torque characteristics and by minimizing of the use of transmissions and reductions, resulting in a virtual zerobacklash design. With an expected 75,000 hours mean time between failure (MTBF), the DBM 2400 Series provides the highest throughput, smallest footprint, and lowest cost of ownership of any dual-arm atmospheric robot in the industry. "The DBM 2400 Series robot is a major breakthrough for the semiconductor equipment industry",said James Cameron, president and chief executive officer of Equipe. "Our customers are not only buying a dramatic increase in equipment throughput, but also an easy migration path to 300mm applications.

(Source: BRA)