The aim of this paper is to provide a new wafer prealigning robot for the photo‐etching facility during the manufacturing of IC products.
The shape center is measured by a reflection‐style laser sensor in the wafer's radial direction, and the position is measured by a penetration‐style laser sensor. A dynamic error compensation is applied to eliminate the radial runout and wobble of the rotary stage, which have effects on the measurement of the wafer's shape center.
It is found that the new wafer prealigning robot can satisfy the accuracy requirement.
The robot requires that the shape center can be accurately calculated.
The robot is applicable to wafer prealigning for the photo‐etching facility.
A wafer prealigning robot based on the shape center calculation method has been developed and is described in the paper.
