Palomar Technologies introduces new automatic ball and wedge bonders

Palomar Technologies introduces new automatic ball and wedge bonders

Keywords: Palomar Technologies, Bonding

Palomar Technologies has announced the latest additions to its line of wire bonding equipment with the introduction of its Model 5060 automatic ball bonder and Model 5070 automatic wedge bonder. These bonders offer large area, deep access, ball and wedge wire bonding for microelectronic packaging and applications.

The new ball and wedge bonders are based on Palomar's proven and reliable 2460 and 2470 platforms, but with a 25 per cent smaller footprint. They have a large 12 × 5 in. work area and are designed for ergonomic operation. The on-screen, menu-driven interface simplifies operator training, allowing for a short path to automated production. The sleek, new design includes control knobs and a keyboard that can be adjusted to optimize the operators working position.

For more information, visit our Web site: www.palomartechnologies.com