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Volume 1, Issue 4
1 January 1984
This article was originally published in
Hybrid Circuits
Hybrid Circuits Cover Image for Volume 1, Issue 4
Review Article| January 01 1984

Materials and Processes for Reliable Soldering of Chip Components Available to Purchase

W. Leibfried
W. Leibfried
Robert Bosch GmbH, Stuttgart, West Germany
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 2977-7062
Print ISSN: 0265-3028
© MCB UP Limited
1984
Hybrid Circuits (1984) 1 (4): 19–25.
https://doi.org/10.1108/eb044140

This paper outlines some general aspects of materials and processes for reliable soldering of chip components and presents some new results on testing of wettability and leaching of thick films, thermal fatigue of solders and the reliability of solder joints on different thick film metallisations.

© MCB UP Limited
1984
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