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Journal Articles

Wetting, Leaching and Solder Adhesion of Copper Thick Film Conductors on Alumina and Multilayer Glasses

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W. Leibfried
Journal: Microelectronics International
Hybrid Circuits (1986) 3 (2): 24–37.
https://doi.org/10.1108/eb044227
Published: 01 February 1986
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Journal Articles

Materials and Processes for Reliable Soldering of Chip Components

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W. Leibfried
Journal: Microelectronics International
Hybrid Circuits (1984) 1 (4): 19–25.
https://doi.org/10.1108/eb044140
Published: 01 January 1984
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