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Volume 1, Issue 4
1 January 1984
This article was originally published in
Hybrid Circuits
Hybrid Circuits Cover Image for Volume 1, Issue 4
Review Article| January 01 1984

A Method for Scanning Electron Microscope Analysis of Laser Drilled Thick Film Vias

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Publisher: Emerald Publishing
Online ISSN: 2977-7062
Print ISSN: 0265-3028
© MCB UP Limited
1984
Hybrid Circuits (1984) 1 (4): 61–63.
https://doi.org/10.1108/eb044145

In order to evaluate laser drilled vias in thick film dielectric materials a method of sectioning twenty micron vias has been developed. The value of the sections is illustrated by comparing vias in various dielectric materials.

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© MCB UP Limited
1984
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