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Volume 10, Issue 2
1 February 1993
This article was originally published in
Hybrid Circuits
Hybrid Circuits Cover Image for Volume 10, Issue 2
Review Article| February 01 1993

Adhesives for Electronic Applications Available to Purchase

J.A. Adell;
J.A. Adell
Telefónica Research & Development, Madrid, Spain
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M. Molina;
M. Molina
Telefónica Research & Development, Madrid, Spain
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J.M. Cavero
J.M. Cavero
Telefónica Research & Development, Madrid, Spain
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 2977-7062
Print ISSN: 0265-3028
© MCB UP Limited
1993
Hybrid Circuits (1993) 10 (2): 54–56.
https://doi.org/10.1108/eb044500

This paper describes the results of an analysis carried out on thermally conductive and electrically conductive adhesives, in order to characterise their behaviour for electronics and telecommunications applications.

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© MCB UP Limited
1993
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