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1 May 1995
Review Article|
May 01 1995
Evaluating a Thick Film System for All Ag and for Pd/Ag, Au ‘Mixed Metallurgy’ Multilayer Applications Available to Purchase
P. Baumbach;
P. Baumbach
ESL Europe/Agmet Ltd, Reading, Berkshire, England
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M. Bilinski;
M. Bilinski
ESL Europe/Agmet Ltd, Reading, Berkshire, England
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J. Whitmarsh;
J. Whitmarsh
ESL Europe/Agmet Ltd, Reading, Berkshire, England
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J. Lorenz;
J. Lorenz
Electro-Science Laboratories, Inc., Portland, Oregon, USA
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P. Bless;
P. Bless
Electro-Science Laboratories, Inc., Portland, Oregon, USA
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M.A. Stein
M.A. Stein
Electro-Science Laboratories, Inc., Portland, Oregon, USA
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Publisher: Emerald Publishing
Online ISSN: 1758-812X
Print ISSN: 1356-5362
© Emerald Group Publishing Limited
1995
Microelectronics International (1995) 12 (2): 18–21.
Citation
Baumbach P, Bilinski M, Whitmarsh J, Lorenz J, Bless P, Stein M (1995), "Evaluating a Thick Film System for All Ag and for Pd/Ag, Au ‘Mixed Metallurgy’ Multilayer Applications". Microelectronics International, Vol. 12 No. 2 pp. 18–21, doi: https://doi.org/10.1108/eb044559
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