This paper presents possibility of laser application for fabrication of 3D elements and structures. The Aurel NAVS‐30 Laser Trimming and Cutting System with special software was used. It was applied successfully for fabrication of vias (minimum diameter – 50 μm) in fired and unfired LTCC ceramics and channels with width between 100 μm and 5 mm. The achievements and problems are presented and discussed. The influence of lamination process on quality of vias and channels as well as the problems connected with interaction of laser beam with ceramic tapes are shown. Three‐dimensional resistors and microfluidic system were successfully designed and fabricated based on our investigations. Chosen electrical and thermal parameters of constructed devices are shown, too.
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1 December 2002
Research Article|
December 01 2002
Laser treatment of LTCC for 3D structures and elements fabrication Available to Purchase
Jaroslaw Kita;
Jaroslaw Kita
Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wroclaw, Poland
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Andrzej Dziedzic;
Andrzej Dziedzic
Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wroclaw, Poland
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Leszek J. Golonka;
Leszek J. Golonka
Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wroclaw, Poland
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Tomasz Zawada
Tomasz Zawada
Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wroclaw, Poland
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Publisher: Emerald Publishing
Online ISSN: 1758-812X
Print ISSN: 1356-5362
© MCB UP Limited
2002
Microelectronics International (2002) 19 (3): 14–18.
Citation
Kita J, Dziedzic A, Golonka LJ, Zawada T (2002), "Laser treatment of LTCC for 3D structures and elements fabrication". Microelectronics International, Vol. 19 No. 3 pp. 14–18, doi: https://doi.org/10.1108/13565360210444998
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