Issues

Appointments

New Head of Electronics and IT appointed

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Gheorghe-Catalin Pascariu Sales Manager for Asia Pacific Region

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Packaging technologies for pressure‐sensors

Marko Pavlin; Darko Belavic; Marina Santo Zarnik; Marko Hrovat; Matej Mozek
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Effect of gamma radiation onto the properties of TeO2 thin films

K. Arshak; O. Korostynska
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Using LTCC for microsystems

Torsten Thelemann; Heiko Thust; Michael Hintz
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On the zero offset stability of thick film strain gauges

Yulan Zheng; John Atkinson; Russ Sion
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Laser treatment of LTCC for 3D structures and elements fabrication

Jaroslaw Kita; Andrzej Dziedzic; Leszek J. Golonka; Tomasz Zawada
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Conference report

Earth Technologies Forum, 2002

Brian Ellis
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Editorial

Special issue – packaging technology for sensors and MEMS

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IMAP news

2003 Conference on Ceramic Interconnect Technology announced

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IMAPS topical workshop on Optoelectronics Packaging and MOEMS

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EMPC 2003 invites abstracts of unpublished work

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IMAPS ceramic workshop paves way for ceramic interconnect technology conference in 2003

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IMAPS topical workshop schedule, content announced

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Thermal & mechanical simulation and experiments in micro-electronics and micro-systems

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IMAPS announces biomedical electronics advanced technology workshop (ATW)

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IMAPS announces program for Nano Systems workshop

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MMRC announces free marketing forum at IMAPS 2002 symposium

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Industry news

Bell Labs claims semiconductor breakthrough

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IMEC announces industrial affiliation program

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ESEC wins large order in Korea

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Micron technology opts for mintech semiconductors

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SUSS MicroTec signs representative agreement with Simac Masic for Probe Systems

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IFR Systems, Inc. agrees to be acquired by Aeroflex Incorporated

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Clear MEMS standards needed for future IC manufacturing

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International diary

International diary

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Internet commentary

Internet commentary

Brian Ellis
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Literati Club

Awards for Excellence

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New products

"Feather touch" multi-tool head enhances throughput for die bonding

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Low temp glass-to-metal preform seals for optic fibres

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Conti Temic microelectronic starts mass production of EGR control units

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GSI Lumonics introduces the TrimSmart ™ LT1100

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Hybrid lids fabricated and plated on same site

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DEK-J2002 from PESL – thick film printing – the new generation

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GSI Lumonics announces new Trimsmart ™ laser trim operating software

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Note from the publisher

Note from the publisher

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