Awards for Excellence
Eric Beyne
Rita Van Hoof
Tomas Webbers
Steven BrebelsIMEC Leuven Belgium
Stéphanie Rossi
Francois LechleityerCIMULEC Ennery, France
Marianna Di IanniCaiLab Technologis, Preganan-Milanese, Italyand
Andreas OstmannTUBerlin Berlin, Germany
Are the recipients of the journal's Outstanding Paper Award for Excellence for their paper
High density interconnect substrates using multilayer thin film technology on laminate substrates - (MCM-SL/D)
which appeared in Microelectronics International Vol. 18 No. 3 2001
A novel interconnect technology, introducing thin film on a laminate substrate base, is presented. A specially constructed laminate board is used as a substrate for the thin film build-up process. The main characteristics of the laminate core substrate are the z-axis electrical connections, the absence of holes in the substrate and the very flat nature of the top surface. As a result,the base substrate can be processed further in a thin film processing line. The manufacturing and properties of these substrates are discussed.
