Design and fabrication of silicon condenser microphone using single deeply corrugated diaphragm technique

A single wafer silicon condenser microphone with a novel single deeply corrugated diaphragm is presented in this paper. The microphone diaphragm with corrugation depth of 100 μm is only 1 mm² in area, while the open‐circuit sensitivity as high as 9.8 mV/Pa under a bias voltage of 6 V has been obtained. The recorded frequency bandwidth is about 20 kHz. The measurements show reasonable agreements with the theoretical predictions.