Experience with AlN Substrate

The similarity of its temperature expansion coefficient to that of silicon, as well as its high thermal conductivity, makes AlN a material suited for application in microelectronics. A comparison of the various AlN manufacturers shows above all differences in the choice of sintering aids and the type of sintering process. A comparison of a standard paste system (Du Pont) with a new special development (Shoei) demonstrates the need for adapting the pastes to AlN ceramics. Thin film technology is possible at a standard similar to that of Al2O3.