Enthone-OMl introduces new micro via dielectric materials: photo definable and laser definable dielectric processes
Enthone-OMl introduces new micro via dielectric materials: photo definable and laser definable dielectric processes
Keywords Enthone-OMI, Microvias
The newest addition to the Enthone-OMl product line, micro via technology is designed to meet both photodefinable and laser definable dielectric requirements.
ENVISION micro via dielectrics utilize standard liquid dielectric application techniques. Photoimaging or laser drilling then follows to define the vias. Micro vias from 25 micron (one mil) utilizing lasers and 50 micron (two mil) utilizing photoimaging are easily achieved. Metallization of the dielectric and the via connection follows standard fabrication processes such as panel plate and etch,pattern plating or full-build electroless copper. Copper-to-dielectric adhesion is greater than 6lb/in. The characteristics of each epoxy-based, liquid material include high Tg > 160°C and high dielectric strength. Coupled with low moisture adsorption and a low co-efficient of thermal expansion (CTE), ENVISION micro via dielectrics are ideally suited for a wide range of PWB and packaging applications.
The use of a dielectric process offers the following benefits:
reduces PWB size and layer count;
utilizes existing PWB manufacturing techniques;
enables higher interconnection density;
reduces overall PWB manufacturing cost.
An ENVISION micro via dielectrics fact sheet listing features, benefits and test approvals is available by contacting Enthone-OMl Inc., PO Box 1900, New Haven, CT 06508. Tel:+1 203-799-4904; Fax: +1 203-799-1513.
