Issues

Appointments

New senior appointments announced at CS2

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Expanding efforts at California Micro Devices attract thin film veteran

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Promotion

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Advanced Surface Technology announces the appointment of vice president

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Self‐managing teams in high technology manufacture: overcoming technological barriers

James McCalman
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Characteristics of passive Ta‐resistive planes embedded in Al‐sheet “PCB” ‐ compatible for integrated MCM‐substrates or packaging carriers

Philip Ivanov Philippov; Milka Markova Rassovska; Radosvet Georgiev Arnaudov; Vassil Angelov Ianev; Minka Draganova Gospodinova
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Higher yields and reliability with automated assembly of microwave modules

Michael Chalsen; Daniel Crowley
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A simple modification of a flip‐chip bonder to allow large area chip attach

S. Fuchs; K. Rindelhardt; J. Barrett; F. Stam
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High performance liquid cooled aluminium nitride heat sinks

R. Hahn; V. Glaw; A. Ginolas; M. Töpfer; K. Wittke; H. Reichl
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Communication

Lessons learnt from the Montreal Protocol

Brian Ellis
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IVF research projects

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Conferences and exhibitions

IMAPS expands scope of Denver conference and gives it a new name

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XIII SBMicro-ICMP '98, Curitiba, Brazil

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China's electronics industry grew by 26.19 percent for the first half of this year

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Editorial

Life cycle and environmental mismatches in electronics for critical applications

F. Patrick McCluskey
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IMAPS diary

IMAPS diary

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IMAPS news

Jim Cook is 1999 President of International Microelectronics and Packaging Society

Brian Ellis
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Industry news

Fife company cleans up in the semiconductor industry

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Philips Components and Pioneer Electronic Corporation to develop the next generation of PDP technology

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Suppliers of assembly and specialist equipment

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Third microsystems MPW service now available from EUROPRACTICE

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Survey points way for new European quality labelling scheme in electronics training

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European design houses to join new EUROPRACTICE 'IC service alliance' program

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Chip scale packaging will not affect bare die market

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Intarsia Corporation and Philips Integrated Passive Components to collaborate on standards for chip scale integrated passive devices

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Schiller Automation Systems LLC

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General Scanning introduces breakthrough process in new chip component trim system

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Philips Semiconductors teams with TSMC and EDB Investments to develop new chip production facility

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Statek Corporation recommended for ISO certification

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Internet patent search service launched

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Palomar Technologies expands presence in Europe

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ITRI releases BGA guidelines report

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International diary

International diary

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Internet commentary

O what a tangled web we weave

Brian Ellis
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New products

Palomar Technologies introduces continuous bonding technology

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Philips Semiconductors introduces low-cost RF front-end IC for wireless equipment

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New backside silicon image enhancing software

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SMT stencil printer offers speed, convenience, productivity, 20 X 20 frame capacity

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New technology in vaporising systems is launched

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New resistor networks protect AMD telecom chip sets against transient power faults under bellcore ITU specs

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Holometrix and Micromet Instruments join to support the electronic thermal management and packaging materials market

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New control system and air-tight sealing techniques slash operating cost of desiccator storage systems

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New semi-auto dicing systems combine enhanced accuracy, advanced software

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K and S introduces programmable manual wire bonders

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Programmable hall-effect sensor replaces mechanical potentiometers and angle measuring devices

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Wafer dicing and singulation system ideal for advanced materials

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Advanced Surface Technology introduces the new plasma system product line

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Vantage produces 3D scans of thick film

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Siemens to commercialize PSGA packaging technology

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Enthone-OMl introduces new micro via dielectric materials: photo definable and laser definable dielectric processes

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Training

Full listing of qualified electronics training courses now available on the Web

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