IMAPS USA
IMAPS USA
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IMAPS '99 announces technical sessions
IMAPS '99, the 32nd International Microelectronics Symposium, will be held October 26-28, 1999, at the Chicago Hilton and Towers, Chicago, IL.
The technical program includes 25 sessions with over 160 presentations that include: flip chip low cost bumping, polymeric materials for packaging, RF, microwave, and wireless(two sessions), thick film technology, flip chip advanced bumping, sensors and MEMS, substrate interface reliability, flip chip manufacturing and assembly assessment, packaging technologies for wireless communications in Japan, high density packaging, modelling and CAD, flip chip and wirebond reliability,emerging technologies, integrated passives, quality improvements in manufacturing, CSP packaging and solder joint reliability, laminated interconnects, advanced technologies in power packaging, LTCC advancements,thermo-mechanical modelling of CSP, alloys for packaging, thermal management,and Midwest Electronics.
For complete program information, visit our Website www.IMAPS.org
The new ceramic initiative
During the 1960s, 1970s and 1980s, thick film ceramic technology earned a reputation for having high reliability and high cost due to its use in a variety of performance driven,low-volume military and aerospace applications. Times have changed and so too has ceramic technology.
Today, advanced ceramic technology is the technology of choice for a whole new generation of designers. Designers of cell phones, pagers, anti-lock braking systems, automotive engine controllers and digital cameras have all rediscovered the benefits of ceramic. Ceramic technology's electrical property stability, high thermal dissipation,and high resolution and high definition conductor lines and spaces and the ability to integrate passive components make it an ideal solution for many of today's consumer electronic devices. To steal a phrase it is not your father's ceramic technology.
To help meet the growing demand among designers for information about ceramic technology, the International Microelectronics and Packaging Society, IMAPS (formerly ISHM)formed and supports the Ceramic Interconnect Initiative (CII). The CII members include representatives from companies at all levels of the industry supply chain, including circuit manufacturers, systems houses and suppliers of substrates, materials and services. The goal of the CII is to educate OEM designers about the benefits of ceramic technology.
A number of seminars and workshops for OEM designers have also been organized. The establishment of the CII is a critical development for the technology and the electronics design community. People who are interested in the CII can obtain information at www.IMAPS.org/cii/cii.htm
Nobel laureate, Leon M. Lederman, to be keynote speaker at IMAPS '99
Leon M. Lederman, Nobel Prize winning physicist and the second director of Fermilab will be the keynote speaker at IMAPS '99, 26-28 October 1999.
Dr Lederman's experiences are linked with his long-term affiliation with Columbia University. His earlier research in high-energy physics brought him into the national science policy circles and in 1963 he proposed the idea that became the National Accelerator Laboratory.
In 1977, Dr Lederman led the team that discovered the bottom quark at Fermilab. The following year he became a director and, under his administration brought Fermilab into its position of scientific prominence. By 1983 the achievement of the world's most powerful superconducting accelerator, the Tevatron, brought Fermilab into worldwide prominence. In 1988, Dr Lederman was awarded the Nobel Prize for Physics.
"IMAPS is indeed honored to have a person of Dr Lederman's stature as the keynote speaker at the 32nd International Microelectronics Symposium. For the first time in our history, we are introducing a Nobel Laureate to our membership and are looking forward to his comments to our membership", stated James T. Cook, IMAPS president.
MCM and microsystems conferences merge
The 6th European Conference on MultiChip Modules (EC-MCM 2000) alongside the European Conference on Microsystems (Microsystems 2000) will be held in London on 24-25 January 2000. Authors are invited to submit papers for this event.
Theme: technology and applications. Dates:24-25 January 2000. Venue:Novotel, Hammersmith. Associated:Table top exhibition. Organizers:IMAPS-UK. Co-sponsors:IEEE CPMT, EUROPRACTICE, IEE.
AbstractPlease send your title and short abstract of your proposed paper to Professor Nihal Sinnadurai. E-mail: nsinnadurai@twi.co.uk
