Issues

Appointments

Horiba president appointed director of SEMI

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Horiba president appointed director of SEMI

Robert Ott selected Asian regional sales manager for Palomar Technologies

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Robert Ott selected Asian regional sales manager for Palomar Technologies

Alphasem appoints new VP sales and marketing

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Alphasem appoints new VP sales and marketing

BC Components Centralab appoints new CEO for Asia-Pacific operations

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for BC Components Centralab appoints new CEO for Asia-Pacific operations

Maximilian Huber will take over responsibility for Europe as Head of Sharp Microelectronics Division in Hamburg

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Maximilian Huber will take over responsibility for Europe as Head of Sharp Microelectronics Division in Hamburg

Professor Gilbert Declerck appointed as new president and CEO

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Professor Gilbert Declerck appointed as new president and CEO

Former general manager of IBM Microelectronics brings more than 30 years' experience to SVG

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Former general manager of IBM Microelectronics brings more than 30 years' experience to SVG

Jay Boyd joins MicroJoin as vice president sales and marketing

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Jay Boyd joins MicroJoin as vice president sales and marketing

A new approach to flip chip on board technology using SMT compatible processes

S. Zhang; J. De Baets; A. Van Calster
View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Open the PDF for in another window
Add to Citation Manager for A new approach to flip chip on board technology using SMT compatible processes

The cyclic fatigue behaviour of ball grid arrays

A.J. Curley; K.J. Williams; T. Le; H. Patel
View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Open the PDF for in another window
Add to Citation Manager for The cyclic fatigue behaviour of ball grid arrays

HDI substrate technology for electronic automotive applications

M. Bremond; D. Lambert
View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Open the PDF for in another window
Add to Citation Manager for HDI substrate technology for electronic automotive applications

Thermal fatigue analysis of the flip chip assembly on the polymer stud grid array (PSGA) package

Bart Vandevelde; Eric Beyne
View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Open the PDF for in another window
Add to Citation Manager for Thermal fatigue analysis of the flip chip assembly on the polymer stud grid array (PSGA) package

Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill

Zhaowei Zhong
View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Open the PDF for in another window
Add to Citation Manager for Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill

High frequency wire bonding for PBGA package, a process optimisation approach

Teo Kiat Choon; Victor G. Corpuz
View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Open the PDF for in another window
Add to Citation Manager for High frequency wire bonding for PBGA package, a process optimisation approach

Low cost high performance microwave structures fabricated by advanced thick film techniques

Barbara Dziurdzia; Stanislaw Nowak; Michal Ciez; Wojciech Gregorczyk; Heiko Thust; Erich Polzer
View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Open the PDF for in another window
Add to Citation Manager for Low cost high performance microwave structures fabricated by advanced thick film techniques

IMAPS diary

IMAPS diary

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for IMAPS diary

IMAPS news

IMAPS Poland

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for IMAPS Poland

IMAPS Nordic

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for IMAPS Nordic

IMAPS Germany

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for IMAPS Germany

IMAPS USA

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for IMAPS USA

IMAPS Japan

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for IMAPS Japan

IMAPS Europe '99 Harrogate

Brian Waterfield; Nihal Sinnadurai
View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for IMAPS Europe '99 Harrogate

Industry news

The worldwide market for digital mobile radio

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for The worldwide market for digital mobile radio

Inseto and Delo in partnership

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Inseto and Delo in partnership

TechSearch International's study shows Japanese companies dominate microvia production

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for TechSearch International's study shows Japanese companies dominate microvia production

VIA electronic GmbH and SOREP-ERULEC S. A. form strategic alliance

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for VIA electronic GmbH and SOREP-ERULEC S. A. form strategic alliance

Maury and ATN announce microwave alliance

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Maury and ATN announce microwave alliance

Du Pont improves thick film product testing facilities

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Du Pont improves thick film product testing facilities

Agreement adds third component to JME/Flomerics Inc. pact signed June 1998

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Agreement adds third component to JME/Flomerics Inc. pact signed June 1998

NPL improves reliability and performance of microelectronics encapsulants

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for NPL improves reliability and performance of microelectronics encapsulants

New MRSI European office opens

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for New MRSI European office opens

Karl Suss acquires product lines of Fairchild Technology SEG

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Karl Suss acquires product lines of Fairchild Technology SEG

CS2 achieves commercial production in record time

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for CS2 achieves commercial production in record time

Heraeus lead-free solder is IDEAL for Marconi

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Heraeus lead-free solder is IDEAL for Marconi

Microelectronic Modules Corp. acquires Switch Power, Inc.

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Microelectronic Modules Corp. acquires Switch Power, Inc.

Heraeus is named preferred supplier for C-MAC industries

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Heraeus is named preferred supplier for C-MAC industries

Total solution, low-cost prototyping and small volume ASICs in 0.25 micron available to US companies

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Total solution, low-cost prototyping and small volume ASICs in 0.25 micron available to US companies

UMC and Virtual Silicon Technology join Europractice MPW service

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for UMC and Virtual Silicon Technology join Europractice MPW service

Stanford selects Europractice IC service for low volume production of highly specialized ASIC

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Stanford selects Europractice IC service for low volume production of highly specialized ASIC

Microsystems roadmap predicts technical challenge for packaging industry

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Microsystems roadmap predicts technical challenge for packaging industry

International diary

International diary

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for International diary

Internet commentary

He trudg'd along, unknowing what he sought (John Dryden, Cymon and Iphigenia)

Brian Ellis
View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for He trudg'd along, unknowing what he sought (John Dryden, Cymon and Iphigenia)

New products

New Leica INS 1000 post-electrical test inspection station

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for New Leica INS 1000 post-electrical test inspection station

Automatic wafer transfer option enables continuous die placement on Quad APS-I advanced packaging system

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Automatic wafer transfer option enables continuous die placement on Quad APS-I advanced packaging system

Palomar upgrades ball bonders with LED-based lighting system and light calibration software

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Palomar upgrades ball bonders with LED-based lighting system and light calibration software

Unique BGA reballing solution from Intertronics

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Unique BGA reballing solution from Intertronics

Closed-loop process control benefits encapsulation

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Closed-loop process control benefits encapsulation

MicroJoin introduces the 4200 PDI pulsed heat hot bar bonder with powered display inspection

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for MicroJoin introduces the 4200 PDI pulsed heat hot bar bonder with powered display inspection

Alphasem's new Swissline 9002 FC/CSP die attach system

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Alphasem's new Swissline 9002 FC/CSP die attach system

New design for surface-mount single in-line packages combines advantages of SMT and SIP hybrid circuitry

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for New design for surface-mount single in-line packages combines advantages of SMT and SIP hybrid circuitry

Dexter introduces Hysol FluxFill 2000 reflow encapsulant designed for flip chip semiconductor devices

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Dexter introduces Hysol FluxFill 2000 reflow encapsulant designed for flip chip semiconductor devices

Speedline Technologies Asia launches small footprint, high performance semiconductor cleaning system

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Speedline Technologies Asia launches small footprint, high performance semiconductor cleaning system

SEC introduces new laser diode bonder

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for SEC introduces new laser diode bonder

Silicon Valley Group unveils Procell™ ­ a vital partner in lithography cluster productivity

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Silicon Valley Group unveils Procell™ ­ a vital partner in lithography cluster productivity

Sonoscan introduces time-saving STAR module

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Sonoscan introduces time-saving STAR module

New from UV Light Technology Limited ­ a range of high performance UV light cabinet systems

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for New from UV Light Technology Limited ­ a range of high performance UV light cabinet systems

New range of polymer thick film materials from Multicore-Asahi includes resistor inks for embedded passives

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for New range of polymer thick film materials from Multicore-Asahi includes resistor inks for embedded passives

Siemens introduces direct die feeder technology for fast, easy placement in chip on board (COB) and flip chip applications

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Siemens introduces direct die feeder technology for fast, easy placement in chip on board (COB) and flip chip applications

Du Pont launches new gold conductor QG150 for high density/high frequency applications

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Du Pont launches new gold conductor QG150 for high density/high frequency applications

New adhesive films from Ablestik

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for New adhesive films from Ablestik

Obituary

Baron Professor Roger Van Overstraeten

View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager for Baron Professor Roger Van Overstraeten