Automatic wafer transfer option enables continuous die placement on Quad APS-I advanced packaging system
Automatic wafer transfer option enables continuous die placement on Quad APS-I advanced packaging system
Keywords Quad Systems Corporation, Pick and place
Quad Systems Corporation is offering a new automatic wafer transfer (AWT) option for the wafer presentation system on its APS-1 pick and place solution.
The AWT enhances the wafer presentation system by providing a continuous supply of wafers to the assembler from a wafer cassette. Dual wafer presentation systems, each fitted with the AWT option, enable continuous pick and place operation. A wafer exchange automatically occurs while the APS-1 continues to pick from the second site.
"The automatic wafer transfer system is ideal for advanced SMT applications that use flip chip technology in high volume production", said Bob Miklosey, product marketing manager for Quad's Advanced Packaging Technology Group. "It is also an excellent solution for flip chip assembly and applications that require two die types."
The AWT option uses a cassette-handling elevator that locates a wafer film frame cassette to allow film frames to be extracted and inserted into the main mechanism of the wafer presentation system. A sensor is used to detect the presence of a cassette. The wafer is moved into position by an X-Y theta table. The system handles film frame sizes up to 8 inches.
The Quad APS-1 advanced packaging system with modular subsystems offers manufacturers the placement precision, speed and flexibility to assemble today's advanced packages. These include chip on board (COB), flip chip on board (FCOB), flip chip on flex(FCOF), chip scale packaging (CSP) and multi-chip module (MCM). The APS-1 also provides full SMT capabilities for mixed technology applications.
