Reports the research and development results on flip chip on FR‐4 and ceramics, using anisotropic conductive film (ACF), anisotropic conductive paste (ACP), or eutectic solder with underfill. Several types of ACF and ACP with different types of conductive particles and adhesives were investigated. Simple but high yield procedures for reworking flip chip on board using ACP and ACF were developed. Processes for flip chip on FR‐4 and ceramic boards using eutectic solder bumps with underfill were also evaluated. The flip chips were assembled on test vehicles for temperature cycling and high‐temperature high‐humidity tests. The reliability performance of the three processes (gold bumps with ACF, gold bumps with ACP, and eutectic solder bumps with underfill) is compared.
Article navigation
1 December 1999
Review Article|
December 01 1999
Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill
Zhaowei Zhong
Zhaowei Zhong
School of Mechanical and Production Engineering, Nanyang Technological University, Singapore
Search for other works by this author on:
Publisher: Emerald Publishing
Online ISSN: 1758-812X
Print ISSN: 1356-5362
© MCB UP Limited
1999
Microelectronics International (1999) 16 (3): 6–14.
Citation
Zhong Z (1999), "Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill". Microelectronics International, Vol. 16 No. 3 pp. 6–14, doi: https://doi.org/10.1108/13565369910293297
Download citation file:
Sign in
Don't already have an account? Register
ICE Member Sign In
Log inPurchased this content as a guest? Enter your email address to restore access.
Please enter valid email address.
Email address must be 94 characters or fewer.
Pay-Per-View Access
$41.00
Rental
This article is also available for rental through DeepDyve.
New and popular articles
Suggested Reading
Reliability of FCOB with and without encapsulation
Soldering & Surface Mount Technology (August,2001)
Optimisation modelling for flip‐chip solder joint reliability
Soldering & Surface Mount Technology (April,2002)
No flow underfill: additional reliability and failure mode analysis
Microelectronics International (August,2002)
Reliability of flip chips on FR‐4 assembled with reduced process steps
Circuit World (September,2001)
Using computer models to identify optimal conditions for flip‐chip assembly and reliability
Circuit World (March,2002)
Related Chapters
Application of risk and reliability to the management of bridges
Bridge Management 5: Inspection, maintenance, assessment and repair: Proceedings of the 5th International Conference on Bridge Management, organized by the University of Surrey, 11–13 April 2005
USING EN 1990 TO IMPROVE CONSISTENCY OF SAFETY FOR STRUCTURAL BUILDING MATERIALS
Application of Codes, Design and Regulations: Proceedings of the International Conference held at the University of Dundee, Scotland, UK on 5–7 July 2005
APPLICATION OF RELIABILITY THEORY IN SERVICE LIFE PREDICTION OF INITIATION TIME
Challenges of Concrete Construction: Volume 3, Repair, Rejuvenation and Enhancement of Concrete: Proceedings of the International Seminar held at the University of Dundee, Scotland, UK on 5–6 September 2002
Recommended for you
These recommendations are informed by your reading behaviors and indicated interests.
