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Journal Articles

Electrical characterisation of BGA package for RF applications

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Arun Chandrasekhar, Eric Beyne, Walter De Raedt, Bart Nauwelaers, Tania Van Bever
Journal: Microelectronics International
Microelectronics International (2002) 19 (2): 13–18.
https://doi.org/10.1108/13565360210427843
Published: 01 August 2002
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Journal Articles

High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM‐SL/D)

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Eric Beyne, Rita Van Hoof, Tomas Webers, Steven Brebels, Stéphanie Rossi, François Lechleiter, Marianna Di Ianni, Andreas Ostmann
Journal: Microelectronics International
Microelectronics International (2001) 18 (3): 36–42.
https://doi.org/10.1108/EUM0000000005830
Published: 01 December 2001
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Journal Articles

Advances in microwave MCM‐D technology

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Philip Pieters, Walter De Raedt, Eric Beyne
Journal: Microelectronics International
Microelectronics International (2000) 17 (2): 19–22.
https://doi.org/10.1108/13565360010332417
Published: 01 August 2000
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Journal Articles

Thermal fatigue analysis of the flip chip assembly on the polymer stud grid array (PSGA) package

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Bart Vandevelde, Eric Beyne
Journal: Microelectronics International
Microelectronics International (1999) 16 (3): 15–21.
https://doi.org/10.1108/13565369910293305
Published: 01 December 1999
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