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Andreas Ostmann
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Journal Articles
High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM‐SL/D)
Available to PurchaseEric Beyne, Rita Van Hoof, Tomas Webers, Steven Brebels, Stéphanie Rossi, François Lechleiter, Marianna Di Ianni, Andreas Ostmann
Journal:
Microelectronics International
Microelectronics International (2001) 18 (3): 36–42.
Published: 01 December 2001
