New VCSEL alignment features added to SEC laser bonders
New VCSEL alignment features added to SEC laser bonders
Keywords Semiconductor Equipment, Laser bonding
Semiconductor Equipment Corporation has announced the availability of two new features, a video image marker and a precising station, on the company's Model 410 and Model 860 Omni™ laser bonders for enhancing precision during pick-up and alignment of VCSELs with target sites on submounts, such as TO headers (Plate 1).
Plate 1VCSEL on TO header with alignment measurement aids incorporating crosshairs,circle overlay and calibrations as displayed on Model 860 bonder's monitor
The new optional video image marker creates and stores a fixed video overlay of cross hairs in the form of a bit map for centering the VCSEL's emission point as well as up to ten different video patterns that can be superimposed on the submount on which the VCSEL is to be bonded. An example of the latter would be a circle overlay image of the outside diameter of the top of a TO header. Custom patterns also can be created. The bonder operator uses these images/patterns to line up the VCSEL to the target bond site on the TO header. The video image marker is capable of calibrating in metric units or inches. The measurements are displayed on the screen of the Model 860's SVGA colour monitor.
The video image marker consists of a keyboard, a control box and X-Y knobs for adjusting the magnified electronic images. It hooks up between the Model 860's color CCD video and the input on a video card for the color monitor for ease of installation.
The addition of the new optional precising station to the bonder's pickup pedestal serves two purposes. It allows the VCSEL to be taken from a Gel Pak with an unheated tool without damaging the Gel Pak and then be subsequently handled with a preheated tool in preparation for placement on the submount. It also holds the VCSEL firmly in place via the vacuum on the precising station so that when the pickup tool lands on the VCSEL its emission point is not moved off center from its alignment with the bonding system's overlay image. Upon contact with the VCSEL, the vacuum on the precising station is turned off, the vacuum on the pick-up tool is turned on and the VSCEL is picked up in preparation for placement on the submount.
In addition to VCSELs, the SEC bonders may be used to bond laser bars/arrays,edge emitting laser diodes, and other semiconductor-based lasers as well as flip chips and eutectic die.
