Issues

Appointments

Philips Semiconductors appoints Indro Mukerjee to drive global marketing and sales

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The use of thick print copper and silver conductors for power applications

David K. Anderson; John Oleksyn; Martin Batson; John Cocker
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Effects of the pre‐neutron irradiation on VDMOSFET sensitivity to heavy ions

C. Salame; A. Hoffmann; F. Pelanchon; P. Mialhe; J.P. Charles
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Energy‐recovery low power C‐PAL flip‐flop design

H.H. Wong; K.T. Lau
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An investigation of the factors influencing stability in continuously‐powered screen‐printed amperometric dissolved oxygen sensors

J.K. Atkinson; W.V. Glasspool
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Investigations of assembly properties of conductive layers in LTCC circuits

A. Bochenek; B. Bober; A. Dziedzic; L. Golonka
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Measurement techniques for the evaluation of thick‐film materials used in wireless applications

Zhengrong Tian; Charles Free
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Conferences and exhibitions

13th European Conference and Exhibition

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Third Annual APEX Conference on Electronics Manufacturing

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IMAPS news

IMAPS USA. Dr Jerry Sergent appointed IMAPS' technical journal editor

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IMAPS USA. "Everything Flip Chip" is focus of IMAPS' 1st conference and exhibition on Flip Chip Technology in Austin

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IMAPS Russia plans technical, organizational workshop

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IMAPS – Diary of events

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IMAPS USA. Optoelectronics Packaging Advanced Technology Workshop Scheduled by IMAPS

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IMAPS Brazil. IMAPS issues call for papers for IMAPS Brazil 2001

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IMAPS USA. IMAPS 2001 heating up; Photonics, Flip Chip, Microwave, tracks are popular symposium topics

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IMAPS Nordic 38th Annual Conference

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IMAPS USA. IMAPS moves to new permanent world headquarters in Washington, DC

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Industry news

Labtech showcases MMIC Capability

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PartMiner announces agreement with Yahoo! industry marketplaces

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Invest in Sweden Agency launches Socware in the UK

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Amkor Technology enters Taiwan semiconductor market, acquiring two established assembly and test companies

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"Mozaik" opens office in Russia

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Infineon Technologies extends its wide-ranging research collaboration with IMEC on basic technologies for next semiconductor generations

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General Hybrid moves across Banbury

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Contax announce new UK & Ireland partnership with ESSEMTEC

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Datacon's 4-million-euro investment: new building ready after just 10 months

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Hitachi joins IMEC's high-k industrial affiliation program

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IMEC and Sony sign research collaboration programs on fundamental technologies for next-generation semiconductor systems and devices

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Celestica completes acquisition of Motorola facilities

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TheSupply and KeyAssets.com create e-marketplace for surplus semiconductor equipment

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ERA Technology ties up with European Microwave week 2001

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International diary

International diary

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Internet commentary

Then I saw that there was a way to Hell, even from the Gates of heaven [1]

Brian Ellis
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New products

Amkor Technology nears qualification of environmentally friendly material alternatives for ball grid array packages

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Festo pneumatic drives reduce contamination from semiconductor processing equipment

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Labtech introduces Universal finish for MMIC packaging

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Introducing the technique for the dynamic hardness measurement of thin films and coatings

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New paste die attach adhesive designed for lead-free initiatives

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New Z motion control design permits precisely controlled die bond loads

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Amkor Technology stacks die 3-high in IC packages; saves money for system designers and manufacturers

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MCE provides customised power modules

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New VCSEL alignment features added to SEC laser bonders

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New automatic ribbon bonder offers industry's fastest wire cycles

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MCE provides electronics protection against nuclear blast

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