Du Pont Semiconductor Packaging & Circuit Materials appoints Fraunhofer IZM as key partner
Du Pont Semiconductor Packaging & Circuit Materials appoints Fraunhofer IZM as key partner
Keywords: Packaging, Electronics
Du Pont Semiconductor Packaging & Circuit Materials have made an applications development agreement with the Fraunhofer Institute for Reliability and Microintegration IZM, one of the leading experts for microelectronics and microsystems packaging worldwide. Fraunhofer will assist in refining and optimising the process of use for the new and growing line of Du Pont materials in wafer level and chip scale packaging.
Du Pont materials for semiconductor packaging currently include polyimide-based dielectric materials for redistribution, passivation and stress buffering from joint venture HD Microsystems; Microlithographic Polymer Films composed of temporary and permanent photoimageable dry films for applications such as wafer bumping, backside wafer coating, other wafer level packaging and microelectromechanical systems (MEMS) applications; and a line of cleaners and removers from Du Pont EKC Technology. The purpose of the agreement with Fraunhofer is to ensure faster integration of materials as the Du Pont offering for packaging applications continues to expand.
Fraunhofer will provide applications expertise and fabrication capability to allow Du Pont and Du Pont customers to develop and demonstrate process and material integration in areas such as bond pad redistribution, wafer bumping and wafer bonding, as well as process aids for cleaning and wafer protection during processing. Fraunhofer will also support Du Pont's new product development efforts and will provide hands on training of personnel.
