Issues

A comparative analysis of interconnection technologies for integrated multilayer inductors

Stephen O’ Reilly; John Flannery; Terence O’ Donnell; Andrew Muddiman; Gerard Healy; Michael Byrne; Sean Cian Ó Mathúna
View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Open the PDF for in another window
Add to Citation Manager for A comparative analysis of interconnection technologies for integrated multilayer inductors

Thin‐film processing on a thick‐film multilayer

Gerhard Klink; Andreas Drost
View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Open the PDF for in another window
Add to Citation Manager for Thin‐film processing on a thick‐film multilayer

Current noise of trimmed thick‐film resistors: measurement and simulation

Achim Raab; Christian Jung; Peter Dullenkopf
View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Open the PDF for in another window
Add to Citation Manager for Current noise of trimmed thick‐film resistors: measurement and simulation

Thermodynamic aspect of the wire‐bonding process

J. Falk
View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Open the PDF for in another window
Add to Citation Manager for Thermodynamic aspect of the wire‐bonding process

Low‐cost fibre‐chip coupling for electro‐optic EMC‐probes

Luc Vanwassenhove
View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Open the PDF for in another window
Add to Citation Manager for Low‐cost fibre‐chip coupling for electro‐optic EMC‐probes

Effects of chip scale package and flip‐chip on the design and manufacturing of electronic products

Petri Savolainen
View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Open the PDF for in another window
Add to Citation Manager for Effects of chip scale package and flip‐chip on the design and manufacturing of electronic products

A five‐layer thin film MCM‐Si design using oxynitride dielectrics

Jo Lernout
View articletitled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Open the PDF for in another window
Add to Citation Manager for A five‐layer thin film MCM‐Si design using oxynitride dielectrics