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Materials characterization of the effect of mechanical bending on area array package interconnects

Daniel T. Rooney, N. Todd Castello, Mike Cibulsky, Doug Abbott, Dongji Xie

Microelectronics International (2003) 20 (1): 34–42.

https://doi.org/10.1108/13565360310455517

Published: 01 April 2003

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